Lam Research TCP 9600
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The Rainbow TCP 9600 Standalone System is a single wafer, vacuum load-locked low pressure metal etch system. Semigroup Equipment Sales provides a customized (to your specifications) totally refurbished Rainbow TCP 9600 Metal Etch Plasma Reactor that is fully tested at our facility. Upgrades included are wafer size conversions, (150mm, 200mm etc.) Electrostatic Chuck Upgrades, Computer Upgrades and more.
Features
- Low Pressure Operation
- High Density Plasma
- Independent Control of Ion Density and Ion Energy
- Patented Planar Coil
- Simple Efficient Design
- Rainbow Platform
- Precise CD Control with minimal profile micro loading
- High Etch Rates
- Wide Process Window, Minimal micro-loading and damage
- Uniform Etch Rate and Ion Current Density
- Ease of Maintenance, Low Cost of Ownership
- Production Proven, High Reliability
- System Reliability
- Uptime Typically >85%
- MTTC 12 Hours
- MTBF> 125 Hours
- MTTR < 4 Hours
Typical Results:
- Al Etch Rate > 8000A/min
- Al Non-Uniformity +/- 15%
Lam Research Rainbow 4520 Etch
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The Lam Research Rainbow 4520 Standalone System is a single wafer, vacuum load-locked low pressure oxide etch system for etching 0.5um Contact holes at aspect ratios of <4:1. This system features a low pressure main chamber for anisotropic etching of dielectric films with low conductance manifold, pick and place wafer transport system with non-wafer contact optical alignment, flat or notch orientation and active temperature control of upper and lower electrodes. The process makes use of a low polymer forming chemistry for high selectivity to polysilicon. The system can also include a Monochromator for automatic endpoint on exposed oxide.
Features
- Single Wafer Etching
- Wafer Temperature Control
- Variable Gap Spacing
- Parallel Plate Reactor
- Inductive RF Auto Tuning
- Simple and Efficient Design
Applications:
- Contact Etch
- Planarization
- Via Etch
- Trench Mask Etch
- Pad Etch
Benefits:
- Individual Wafer Etch for Repeatable Results
- Reduced Loading Effects
- Profile Control
- Extended Over Etch Capable
- End Point Detector
- Wide Process Window
- Proven Oxide Etch Technology
- Fast, Accurate RF Tuning for Precise Etch Rate Control
- Reduced Defect Densities
- Ease of Maintenance
- Low Cost Of Ownership